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OmniVision OV5642 1.4 µm Backside Illumination CMOS Image Sensor
Imager Process Review
(IPR-0907-802)
Circuit Analysis Report
(CAR-0908-805)

Key Features

  • 1.4 µm pixel CIS module for camera phones
  • Backside illuminated CIS in bulk silicon process
  • OmniBSI™ technology jointly developed by OmniVision/TSMC

About this Device
The OV5642 is a ¼ inch, 5 Mp SoC sensor designed for mobile phones and other small devices. This is OmniVision’s most advanced sensor, featuring both 1.4 µm technology and backside illumination.

The Imager Process Review
The Imager Process Review (IPR) is designed to show clients the process technology used to manufacture the device. It has features specifically designed for the image sensor market.

The Circuit Analysis Report
A Circuit Analysis Report for an image sensor shows the output path from the pixel to the ADC. The analysis is delivered in the ICWorks Browser software for navigating the circuit schematics, cross-referencing the schematics to the layout images, and exporting netlists for simulation.

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(click the report link for more information)

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