Process Review
Process Review Reports (PPR): Fabrication process intelligence.
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Chipworks' Process Review Reports provide a comprehensive analysis of the process technology and design rules used to fabricate a device. The scope of the analysis is similar to that of our Structural Analysis Reports, however it does not include TEM or materials analysis - although such analyses are available as options. Instead, we focus exclusively on the fabrication process which allows us to offer the report at a lower price - while still practicing evidence-based reporting to reinforce our analysis.
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Report Contents:
- Packaging overview including a package x-ray.
- Annotated die photograph identifying the location of memory blocks, significant components and sites where the various analyses were performed. If necessary, a photograph of a partially delayered die may also be included to reveal the die floor plan.
- Top-down layer-by-layer analysis of the back-end processing, presented with SEM images to support each area of discussion. The overall structure is shown with details of the bond pads, dielectrics, metallization, vias and contacts. Material identification is based on the most probable composition of the feature discussed.
- Analysis of the front-end processing including SEM images of the poly, transistors, isolation and substrate doping. SCM imaging and SRP analysis are used to profile the N and P type regions within the substrate.
- Memory cell analysis - if the device is a memory device or has a substantial amount of embedded memory. This includes a schematic of the unit cell, plan view SEM images of the cell delayered to the metal through substrate levels, and cross-section images parallel to the bit line and word line.
- Optional components: TEM, TEM-EDS, SIMS.
The front end of our Process Review Reports includes an introduction, a device summary and a review of the major findings. From there the report is organized in an outside-in manner starting with a discussion of the parent product.
Resources and Related Information
Process Review Report Overview