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Toshiba THGBM2G6D2FBAIE 32 Gb MLC 32 nm NAND Flash Toshiba THGBM2G6D2FBAIE 32 Gb MLC 32 nm NAND Flash 
Structural Analysis Report (SAR-1009-801)

Description: The THGBM2G6D2FBAIE 32 Gb MLC NAND Flash from Toshiba was built with the latest and smallest NAND... more...

 

Texas instruments OMAP3630 Application Processor Texas instruments OMAP3630 Application Processor 
Functional Analysis Report (FAR-1008-801)

Description: The Texas Instruments OMAP3630 was fabrictated at UMC in the 45 nm low power CMOS fab. The OMAP 3630... more...

 

AKM AK8975 Electronic Compass AKM AK8975 Electronic Compass 
Exploratory Report (EXR-1007-804)

Description: AKM Semiconductor has manufactured the AK8973, AK8974 and AK8975 compasses. The AK8975 is a 3-axis... more...

 

Texas Instruments / UMC  XAM3715CBC 45 nm Application Processor Texas Instruments / UMC XAM3715CBC 45 nm Application Processor 
Package Analysis Report (PKG-1006-801)

Description: The XAM3715 high-performance, applications processors are based on enhanced... more...

 

STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope 
Exploratory Report (EXR-1006-802)

Description: The L3G4200D is a low-power, three-axis, gyroscope integrated into a 4 mm x 4 mm LGA package,... more...

 

Omnivision OV5650 CMOS Image Sensors from the Apple iPhone 4 with Comparison to the OmniVision OV5642 BSI Sensor Omnivision OV5650 CMOS Image Sensors from the Apple iPhone 4 with... 
Exploratory Report (EXR-1006-803)

Description: The Apple iPhone has an OmniVision 5 Mp sensor, promoted by Apple to have 1.75 µm pixels and to... more...

 

STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope 
ICWorks Surveyor (ICS-1006-801)

Description: The L3G4200D is a low-power, three-axis, gyroscope integrated into a 4 mm x 4 mm LGA package,... more...

 

Texas Instruments / UMC XAM3715CBC 45 nm Application Processor Texas Instruments / UMC XAM3715CBC 45 nm Application Processor 
Functional Analysis Report (FAR-1006-804)

Description: The XAM3715 high-performance, applications processors are based on enhanced... more...

 

Sony Second Generation BSI CIS IMX050 Sony Second Generation BSI CIS IMX050 
Circuit Analysis Report (CAR-1006-806)

Description: The Sony IMX050 is a backside illuminated image sensor featuring 10.34M pixels wth a pixel size of... more...

 

Invensense IDG-650 Dual-Axis MEMS Gyroscope Invensense IDG-650 Dual-Axis MEMS Gyroscope 
Exploratory Report (EXR-1005-802)

Description: The IDG-650 is an integrated dual-axis angular rate sensor (gyroscope) fabricated using ... more...

 

Winbond W971GG6JB-25 1G bits DDR2 SDRAM Focused Front End Process Technology Winbond W971GG6JB-25 1G bits DDR2 SDRAM Focused Front End Process... 
Process Review (PPR-1005-802)

Description: The W971GGJB is a 1 Gbit DDR2 SDRAM organized as 8,388,608 words x 8 banks x 16 bits. The device... more...

 

Sony IMX050 Second Generation BSI CMOS Image Sensor Sony IMX050 Second Generation BSI CMOS Image Sensor 
Imager Process Review (IPR-1004-802)

Description: The Sony IMX050 is a backside illuminated image sensor featuring 10.34M pixels wth a pixel size of... more...

 

Invensense IDG-650 Dual-Axis Gyroscope (MEMS) Invensense IDG-650 Dual-Axis Gyroscope (MEMS) 
ICWorks Surveyor (ICS-1005-802)

Description: The IDG-650 is an integrated dual-axis MEMS rate gyroscope designed for game controllers and A/V... more...

 

Invensense ITG-3200 3-Axis Digital Gyroscope (MEMS) Invensense ITG-3200 3-Axis Digital Gyroscope (MEMS) 
ICWorks Surveyor (ICS-1004-802)

Description: The ITG-3200 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyro... more...

 

Invensense ITG-3200 Single-Chip 3-Axis Digital Gyroscope Invensense ITG-3200 Single-Chip 3-Axis Digital Gyroscope 
MEMS Process Report (MPR-1004-801)

Description: The ITG-3200 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyro... more...

 

Apple 339S0084 (APL0398B01 die) A4 Processor Samsung 45nm Process and Layout  Analysis Apple 339S0084 (APL0398B01 die) A4 Processor Samsung 45nm Process and... 
Exploratory Report (EXR-1004-803)

Description: The Apple A4 microprocessor, fabricated by Samsung, is the result of Apple's design acquisitions of... more...

 

Bosch BMA220 3-Axis Accelerometer MEMS Bosch BMA220 3-Axis Accelerometer MEMS 
Exploratory Report (EXR-1004-901)

Description: The BMA220 is an ultra small triaxial, low-g acceleration sensor with digital interfaces, aiming for... more...

 

Bosch BMA220 3-Axis Accelerometer (MEMS) Bosch BMA220 3-Axis Accelerometer (MEMS) 
ICWorks Surveyor (ICS-1004-901)

Description: The BMA220 is an ultra small triaxial, low-g acceleration sensor with digital interfaces, aiming for... more...

 

Realtek RTL8367R 5 Port Home Theater and Gaming Network Switch Realtek RTL8367R 5 Port Home Theater and Gaming Network Switch 
Functional Analysis Report (FAR-1004-801)

Description: The RTL8367R is a 128 pin, high performance 5 port gigabit Ethernet switch, which supports... more...

 

OmniVision 8 Mp, 1.4 µm Pixel Pitch,  OmniBSI CMOS Image Sensor from JVC Picsio GC-FM1 (likely OV8810) OmniVision 8 Mp, 1.4 µm Pixel Pitch, OmniBSI CMOS Image Sensor from... 
Exploratory Report (EXR-1004-902)

Description: OmniVision OV276AU_1 Die Markings (Likely OV8810) CMOS Image Sensor from the JVC Picsio GC-FM1 more...

 

Marvell 88E6350 7 Port AVB Gigabit Ethernet Switch Marvell 88E6350 7 Port AVB Gigabit Ethernet Switch 
Functional Analysis Report (FAR-1003-901)

Description: The 88E6350R features 7 port gigabit Ethernet switches with five integrated gigabit Ethernet... more...

 

STMicroelectronics LSM303DLH 3-axis accelerometer and 3-axis magnetometer STMicroelectronics LSM303DLH 3-axis accelerometer and 3-axis magnetometer 
MEMS Process Report (MPR-1002-801)

Description: The LSM303DLH has a linear acceleration full-scale of ±2 g / ±4 g / ±8 g and a... more...

 

Samsung K4B1G0846F-HCF8, 48 nm, 1GB DDR3 SDRAM - DLL and I/Os Samsung K4B1G0846F-HCF8, 48 nm, 1GB DDR3 SDRAM - DLL and I/Os 
Circuit Analysis Report (CAR-1002-805)

Description: The Samsung K4B1G0846F-HCF8 1Gb DDR3 SDRAM F-die is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit... more...

 

Oki 2BM6143-G01 MCU  Metal 1 and Polysilicon layer Oki 2BM6143-G01 MCU Metal 1 and Polysilicon layer 
ICWorks Surveyor (ICS-1002-901)

Description: The Oki 2BM6143 microcontroller (MCU) was extracted from the Casio GW2500 solar powered watch. The... more...

 

Marvell 98DXH325A1 Packet Processor from a 3Com® Baseline Plus Switch 2952 Analysis Including Cost Analysis Marvell 98DXH325A1 Packet Processor from a 3Com® Baseline Plus Switch... 
Functional Analysis Report (FAR-1001-902)

Description: The Marvell 98DXH325A1 is a packet processor chip extracted from a 3Com® Baseline Plus Switch... more...

 

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